Gold Plating -
Yellow to orange color depending on proprietary process used. Semi-bright finish depending on basis metal. Good corrosion resistance, and has high tarnish resistance. Provides a low contact resistance, and is a good conductor. Has excellent solderability. Unless otherwise specified, an intermediate nickel plate is required on copper base alloys or copper plated surfaces prior to the gold plating. |
Specification
|
Thickness
|
Comments
|
MIL-G-45204C
|
| Class 00 |
0.00002" min. |
Grade A 90 Knoop max. |
| Class 0 |
0.00003" min. |
Grade B 91-129 Knoop |
| Class 1 |
0.00005" min. |
Grade C 130 - 200 Knoop |
| Class 2 |
0.00010" min. |
Grade D above 200 Knoop |
| Class 3 |
0.00020" min. |
|
| Class 4 |
0.00030" min. |
Type I (Grades A, B or C) |
| Class 5 |
0.00050" min. |
Type II (Grade B, C or D) |
| Class 6 |
0.00150" min. |
Type III (Grade A only) |
|
Type I - 99.7% pure gold
Type II - 99.0% pure gold
|
ASTM B488
|
| Type I |
Purity |
99.7% gold min. |
| Type II |
|
99.0% gold min. |
| Code A |
Hardness |
90 HK (25gr) max |
| Code B |
|
90-200 HK (25gr) |
| Code C |
|
130-200 HK(25gr) |
| Code D |
|
200 min HK(25gr) |
| Class |
Thickness |
Thickness shall be specified as minimum in micrometers such as 0.25, 0.50, 0.75, 1.00.... |
|
Very compatible to MIL-G-45204 except that adhesion bake test (If Chosen) will be @ 570°F-660°F for 30 minutes. |
AMS 2422
|
|
|
